MZ Technologies Named 3DInCites Start-up Of The Year
3DInCites lauded GENIO™ for considering multiple components that enable 3D co-packaging of chips and chiplets down to the PCB level. It also pointed out that GENIO supports the design of 2D, 2.5D, and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package, and PCB. The announcement also recognized that GENIO provides three different versions specifically tuned for 2.D, 2.5D and 3D design.
“We at 3DInCites have been hearing good things about MZ Technologies and now that GENIO has come to market, believed it was the appropriate time to recognize their ground-breaking accomplishments,” said Françoise von Trapp, 3DInCites Co-Founder.
“We are humbled and honoured to have GENIO™ recognized by a forward-looking technology advocate like 3DInCites. Their membership includes some of the biggest names in the technology space…